Advancements in Semiconductor Manufacturing: Embracing the Challenges of Next-Generation Technologies

Title: Advancements in Semiconductor Manufacturing: Embracing the Challenges of Next-Generation Technologies

Introduction: In recent years, the semiconductor manufacturing industry has witnessed significant expansion in the post-process domain, driven by the flourishing artificial intelligence (AI) market. This surge in demand has accelerated the practical implementation of new deployment technologies downstream, such as the innovative "chiplet" approach, where multiple semiconductors are treated as a single chip. As the complexity of post-process technologies increases, there is a growing expectation that this will elevate the demand for materials. Chemical manufacturers are strategically leveraging expertise gained in pre-processing materials to propose cross-domain technological solutions, aiming to secure a substantial market share.

Chiplet Technology and Silicon Wafer Challenges: The semiconductor manufacturing landscape has shifted its focus to post-process implementation technologies, emphasizing performance improvement irrespective of circuit miniaturization. Advanced semiconductors, particularly those designed for AI applications, employ the "chiplet" technique. This involves disaggregating circuits that were traditionally integrated into a single chip, connecting them through an interposer, such as silicon or organic substrates. Silicon wafer giant SUMCO predicts a more than twofold increase in wafer consumption due to the demand for high-performance silicon substrates in interposers, coupled with the challenges posed by larger chip packages resulting from the use of multiple chips.

Innovations in CMP Slurries: Companies are responding to the evolving landscape with innovative solutions. FujiFilm, for instance, has recently commenced mass production of Chemical Mechanical Polishing (CMP) slurries tailored for post-process applications. CMP slurries are abrasive materials designed to uniformly polish semiconductor surfaces with varying hardness wiring and insulating films. The new materials play a crucial role in flattening the "rerouting layers" that connect semiconductor chips and wiring boards. FujiFilm, leveraging its leading share in CMP slurries for copper wiring, has adapted its technology from pre-processing to meet the demands of the post-process phase.

Diversification in Materials Development: JSR, a key player in the industry, is aiming to introduce photosensitive insulation materials based on polyimide (PI) for rerouting layers in the coming years. This move towards diversification aligns with the growing need for materials that prioritize reliability while meeting various requirements such as high resolution and warp suppression. JSR's comprehensive portfolio, including resist materials, positions it to cater to the diverse demands emerging in the post-process domain.

Industry Giants Strengthening Post-Process Capabilities: With the surge in demand for AI semiconductors, major players are intensifying their efforts in post-process enhancement. TSMC from Taiwan has announced plans to double its production capacity for advanced packaging by the end of 2024. Similarly, Samsung Electronics has declared the establishment of a new facility in Yokohama, demonstrating their commitment to reinforcing research and development capabilities in the post-process phase.

Conclusion: As the semiconductor industry navigates the challenges and opportunities presented by next-generation technologies, it is evident that post-process advancements play a pivotal role in shaping the future landscape. The collaborative efforts of chemical manufacturers, silicon wafer producers, and material developers, along with the strategic moves of industry giants, underscore the importance of embracing innovation in the post-process domain. With the potential for significant market shifts, suppliers who can adapt to changing dynamics in the semiconductor manufacturing landscape are poised to capitalize on the new opportunities emerging in the post-process sector.